| 摘要 |
PROBLEM TO BE SOLVED: To easily select adhesive by reinforcing the adhesive force of a card substrate. SOLUTION: A plurality of holes 13a and 13b are formed so as to be dispersed at the part of a substrate 11 where circuit parts 12a and 12b are not arranged so that a component film 10 can be manufactured. Adhesive layers 21 and 22 having fluidity at the time of working are arranged along the surface and back face of the component film 10, and a pair of laminated films 31 and 32 are arranged outside the layers, and a part of the adhesive layers 21 and 22 is allowed to flow in the holes 13 at the time of laminating the whole card, and the flowing adhesive layers 21 and 22 are fused and integrated. |
