| 摘要 |
PROBLEM TO BE SOLVED: To protect an integrated circuit chip having a bump electrode structure against a trouble such as cracking CK caused by shear strain when it is mounted. SOLUTION: The pump electrode structure is equipped with a connecting electrode 2 formed on the integrated circuit chip, a protective film 3 which is provided with an opening H at its center and covers the connecting electrode 2 and its vicinity, and a bump electrode 6 formed on the connecting electrode 2 exposed in the opening H. A photomask having a mask pattern of making the corner KD of the opening H is used when the opening H is provided to the protective film 3 through a photolithography method. |
