| 摘要 |
PROBLEM TO BE SOLVED: To enable an electronic component to be mounted on a board with sufficiently high positional accuracy, irrespective of the thermal expansion of an electronic component mounting apparatus. SOLUTION: The electronic component mounting apparatus comprises a thermal expansion mark 54, fixed to a mounting head 32 of the electronic component 30, for detecting thermal expansion amount of a Y-axis ball screw 40, a photographing unit 52 fixed to an apparatus body 12, and a controller for deciding a command signal to be supplied to a driver of the screw 40, so as to suppress the reflection of the error, depending upon the thermal expansion to an actual position in the Y-axis direction of the head 32, based on the photographing result of the mark 54 by the unit 52. |
