| 摘要 |
A chip carrier assembly and support arrangement provides a thermally and conductively secure chip interface, and enables rapid insertion and removal of the carrier so that replacement or repair of MMIC components may be facilitated. The chip carrier, which contains one or more chip cavities, is cylindrically configured and made of a material that has a coefficient of thermal expansion that is relatively low compared to that of its surrounding housing, so that a substantially uniform radial compressive force, resulting from the difference in coefficients of thermal expansion of the housing and the carrier, acts uniformly between the cylindrical sidewall of the cylindrical slot in the housing and the cylindrical sidewall of the carrier, thereby securing the chip carrier to the housing and providing thermal and electrical continuity between the carrier and its support housing. With thermal control and electrical grounding accomplished at its cylindrical perimeter, the thickness of the chip carrier becomes non-critical and can be tailored for heat spreading and ease of fabrication.
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