发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To suppress reduction in hFE in a high current region as well as the increased reactive current in a base current. SOLUTION: This semiconductor device is provided with a second conductivity-type epitaxial layer on a first conductivity-type semiconductor substrate with a second conductivity-type embedded diffusion layer in between, and it is also provided with first conductive type upper and lower diffused layers or a single diffused layer that is for splitting circuit constituent elements integrated on the surface of the epitaxial layer. Lateral transistor emitter and collector, as an element among the circuit constituent elements, are of the same conductivity-type as a first conductivity-type upper diffused layer, the upper and lower diffused layers or single diffusion layer, and have identical concentration of impurities.
申请公布号 JP2002217401(A) 申请公布日期 2002.08.02
申请号 JP20010012056 申请日期 2001.01.19
申请人 SHARP CORP 发明人 MAEDA AKIYUKI
分类号 H01L21/331;H01L21/8228;H01L27/082;H01L29/732;(IPC1-7):H01L29/732;H01L21/822 主分类号 H01L21/331
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