| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin type metal package for mounting capable of utilizing a metal being easily obtained and enabling junction under a lead-free state. SOLUTION: The metal package for mounting has a metallic bottom plate 20 on which a part 10 is loaded. A metallic cover 30 has a top surface 31 and a side face 32 formed in an L shape in the periphery of the top surface, the part 10 is housed on the inside and the side face 32, and the cover 30 is joined with the periphery of the metallic bottom plate 20. The external angle sections 34a of the L-shaped corner sections 34 of the cover side face 32 are formed in a curved surface shape, stepped sections are formed to sections corresponding to the L-shaped corner sections 34 of the bottom plate 20, and contacting sections with the cover side face 32 of the bottom plate 20 are made thinner than a central section where the part 10 is arranged. The stepped sections 21 of the bottom plate are formed in the curved surface shape approximately fitted to the L-shaped corner sections 34 of the cover side face, and the bottom plate 20 and the cover 30 are joined under the state in which the curved surface- shape sections of these bottom plate and cover are fitted.
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