| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the production cost of a plastic leadless chip carrier substrate which can be coped with a narrow pitch becomes higher because of its low productivity. SOLUTION: In a method of manufacturing a substrate for semiconductor package, the substrate is manufactured in such a way that external electrode patterns which are connected to each other by a tenting method are first formed by drilling long first press holes, and external electrodes are separated from each other by drilling second press holes. Therefore, the method becomes inexpensive and highly reliable because the pitch is narrow and such surface treatment as nickel and gold electroplating can be performed.
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