| 摘要 |
PROBLEM TO BE SOLVED: To enable a part to be very accurately bonded at a required position on a heat sink as a mounting object through a simple process and a structure. SOLUTION: A bonding device is equipped with an arranging mechanism 16 which arranges an LD chip 12 at a bonding position on the heat sink 14, first and second image pick-up means 18 and 22 which are disposed on the surfaces 12a and 12b of the LD chip 12, respectively, first and second lighting means 20 and 24 which are arranged so as to oppose the image pick-up means 18 and 22 with of the LD chip 12 between, an image processor 26 which enables the images picked up through the image pick-up means 18 and 22 to undergo a binarization process and calculates parallelism, and an inclination adjusting mechanism 28 which makes the angle adjustment of the heat sink 14 so as to enable the calculated parallelism to be within a specified tolerance.
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