| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment apparatus and its method of which a treatment process is simple, causes less damage to a substrate, and the substrate of a large area can be relatively, uniformly treated. SOLUTION: Since a pulse laser light LB1 passing from a beam shaping optical system 34 moves from one end to the other end on a surface of a object to be treated WO as a line beam image extending in the direction Y, a step scanning is carried out over the entire surface of the object to be treated WO. Since a pulse laser light LB2 passing from a beam shaping optical system 44 similarly moves on the back side of a object to be treated WO as a line beam image, a step scanning is carried out over the entire back side of the object to be treated WO. A high-melting-point metal film FL can be previously heated by the energy of the first laser light LB2 before the main heating is carried out by the first laser light LB1, therefore, a predetermined region of the high- melting-point metal film FL can be sufficiently melted even if the energy of the first laser light LB1 is not so high.
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