| 摘要 |
PROBLEM TO BE SOLVED: To provide an easy wafer recovery method for a wafer polishing apparatus after a wafer polishing is completed, and the apparatus. SOLUTION: After a wafer polishing is completed, the wafer is protruded a predetermined length from the peripheral edge of a polishing pad 20 by sliding the wafer W along the polishing pad 20. Then a fluid is emitted into the clearance between the protruded wafer W and the polishing pad 20 from a wafer separation nozzle 18. The emitted liquid gets into the clearance between the wafer W and the polishing pad 20, which uplifts the wafer from the polishing pad 20 to separate the wafer. Consequently, the wafer can be efficiently withdrawn from the polishing pad 20 without adding stiff force to the wafer. |
