| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer plate for pattern formation that can improve the shape and alignment accuracy of the wiring pattern or the pattern of bumps, etc., of a substrate for semiconductor device at the time of forming the pattern, and to provide a method of manufacturing the substrate for semiconductor device using the plate. SOLUTION: The transfer plate 100 for pattern formation has a projecting pattern 21 formed on a base 11 and the upper surface of the pattern 21 is recessed. The pattern 21 is formed on the base 11 by using such an elastic material as silicone rubber, etc. A pattern forming material layer 51 is formed by supplying a pattern forming material to the recessed sections of the pattern 21 of the plate 100. The substrate for semiconductor device having a transferred pattern (bumps, etc.), 51a formed on a wiring board is obtained by pressing the projecting pattern 21 of the transfer plate 100 against a substrate 61 to be transferred composed of the wiring board and removing the plate 100 from the substrate 61 after applying a pressure to the plate 100.
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