| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, and its manufacturing method, in which the gap between a core material and a semiconductor chip can be filled sufficiently with sealing resin. SOLUTION: The semiconductor device comprises a semiconductor chip 15, a core material 10 bonded to a region of the semiconductor chip except the chip electrode 15a, a wiring part 12 provided on the surface of the core material, means 17 for connecting the chip electrode 15a of the semiconductor chip 15 electrically with the wiring part 12, a resin 18 sealing the chip electrode 15a and the connecting means 17, and an external electrode 19 provided at the wiring part 12. Since a member 11 for keeping a space is disposed between the core material 10 and the semiconductor chip 15, sufficient resin seal can be ensured.</p> |
