| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor optical device mounting body which is hard to reduce its package size, but reduced to a chip size through a simple method. SOLUTION: A package structure of a light emitting device and a photodetector or a semiconductor optical device composed of a combination of them is composed of a semiconductor part and an optical part which are arranged side by side, so that the package structure is hard to be miniaturized. In a conventional structure, a semiconductor chip is held by a lead frame, and an optical part is mounted thereon. A flip chip light emitting diode 1 is mounted on a printed wiring board 10 provided with an output window 10a, and, the output window 10a and a gap between the chip 1 and the printed wiring board 10 are filled up with transparent resin 4 for forming a mounting package. The printed wiring board is made so as to hold the chip and to have an optical function to reduce the semiconductor optical device mounting body to the chip size. This structure is applied to the phototransistor and a photo coupler so as to realize the semiconductor optical device mounting body of the chip size. |
