| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a work holder for a bonding device which is capable of effectively absorbing the thermal expansion of its work holder and surely holding all the holding range of lead part of a lead frame. SOLUTION: First slits 20A and 20B are formed surrounding bonding windows 11A, 11B, and 11C, second slits 21A, 21B and 22A, 22B are provided extending outward from ends of the first slits 20A and 20B, respectively, and first connecting parts 30 and 31 are formed. Third slits 25 and 26 are formed outside of the second slits 21A, 21B and 22A, 22B, crossing the first connecting parts 30 and 31 at right angles, respectively, and second connecting parts 32 and 33 are formed.</p> |
