| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable electrical connection between substrates and mounting of components, irrespective of the conditions of height or the like of components mounted on the substrates. SOLUTION: In this substrate structure, a third substrate is sandwiched between a first substrate and a second substrate, and lands on the third substrate are electrically connected with the first substrate and the second substrate. A substrate bored hole corresponding to shapes of components mounted on the first substrate and the second substrate is formed on the third substrate, and recessed parts for conductive adhesive agent, solder, etc., are formed at centers of the lands of the third substrate.</p> |
