| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device in which miniaturization is enabled by conducting easily a common signal in device division segments of minimum unit, when a plurality of the device division segments of minimum unit are gathered and used. SOLUTION: In the state before division that two device division segments 1a, 1b of minimum unit are arranged adjacently, the respective segments 1a, 1b have individually at least one electrode pad S which can input and output an electric signal. Above an element forming surface, at least a pair of electrode pads S1, S2 between the segments 1a and 1b are mutually connected through wiring 5 of conductor, across the segments 1a, 1b. Electrodes 7 for outer connection are installed on the wiring 5.</p> |
