发明名称 METHOD OF MANUFACTURING ELECTROSTATICALLY ATTRACTING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electrostatically attracting board which can manufacture the board easily and simply, and in a short period. SOLUTION: In the manufacturing method of the electrostatically attracting plate, a conductive layer to serve as an electrode is provided on insulating base material to serves as a rear board or on an adsorption layer, and a resist image is formed in a shape of electrode pattern on the conductive layer by the ink jet direct drawing, using thermofusing ink which is solid at normal temperature, next the conductive layer is etched thereby forming an electrode, and then the attraction layer and the rear board are bonded or thermofused together.</p>
申请公布号 JP2002218776(A) 申请公布日期 2002.08.02
申请号 JP20010007587 申请日期 2001.01.16
申请人 MITSUBISHI PAPER MILLS LTD 发明人 TAKAGAMI YUJI;ISHIGURO HIDEAKI;MIDORIKAWA MASATOSHI
分类号 H05K3/06;H01L21/68;H01L21/683;H02N13/00;(IPC1-7):H02N13/00 主分类号 H05K3/06
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