| 摘要 |
PROBLEM TO BE SOLVED: To improve stability of layer connection and copper foil peeling strength of a surface layer in a high density substrate. SOLUTION: The method is provided with a core lamination process for laminating a core substrate material and one or more core metal sheets, a core circuit formation process for forming a circuit on the metal sheet for making it a core circuit formation substrate, a multilayering lamination process for laminating one or more multilayering metal sheet, one or more multilayering substrate material and one or more core circuit formation substrate and a multilayering circuit formation process for forming a circuit on the multilayering metal sheet. In the constitution, a core substrate and a multilayering substrate are of different materials. Thereby, it is possible to stabilize the quality, etc., of interlayer connection in a core circuit forming substrate and to solve problems, such as those related to mechanical strength, including peeling strength of a surface layer circuit through the multilayering lamination by using a multilayering substrate material. |
