发明名称 ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which is improved in productivity, because the component require no protective material or a thin protective material only, and are environmentally-friendly, because the component substantially contains no lead. SOLUTION: The electronic component is equipped with an element forming film 12 provided on a base 11, an element section S provided in the first portion of the film 12 by forming grooves 13, etc., and a protective film 15 which is provided on the film 12 by using a material having a high weather resistance and high wettability to a bonding material. The second portion of the film 12 which is different from the first portion is constituted in terminal sections 17 and 18 and, at the same time, the protective film 15 is also provided on the surfaces of the terminal sections 17 and 18.
申请公布号 JP2002217001(A) 申请公布日期 2002.08.02
申请号 JP20010014159 申请日期 2001.01.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKIDA HIROMI;ISOZAKI KENZO;SASAKI KATSUMI;IWAKIRI YOSHIAKI
分类号 H01C1/14;H01C17/28;H01F17/00;H01G4/252;H01Q1/40;(IPC1-7):H01C1/14 主分类号 H01C1/14
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