| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly reliable semiconductor device in which thermal stress is relaxed at the connection part between a wiring terminal and an insulating substrate on which a semiconductor chip is mounted. SOLUTION: A wiring terminal 14 for electrically connecting an external input/output terminal 10-1 to a wiring pattern 4 of an insulating substrate 2 on which a semiconductor chip 1 is mounted, is constituted in such a way that a first metal plate 10 and a second metal plate 11 are arranged mutually separated and slidably in a sealing package 7, while the facing ends of these metal plates 10, 11 are mutually connected electrically by metal wires 12. |
