| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic wire bonder which is capable of restraining stress from being concentrated on a joint surface. SOLUTION: A wire clamp 4 is fixed to an arm 1, a wire holder 5 is fixed to the wire clamp 4, a bonding tool holder 8 is fixed to an ultrasonic horn 2, and a bonding tool 7 is fixed to the bonding tool holder 8. An aluminum wire 6 is fed through the wire holder 5. A drawing preventive tool holder 9 is fixed to the tip of the arm 1, and a drawing preventive tool 10 is fixed to the tip of the drawing preventive holder 9. A board 23 on which a semiconductor chip 21 and an external leading terminal 22 are fixed is set on a table 24. The free end of the wire 6 is fixed by the drawing preventive tool 10 so as to reduce the applied pressure of the bonding tool 7, by which the semiconductor chip 21 can be protected against cracking. |
