发明名称 |
MATCHING CIRCUIT, AND METHOD AND APPARATUS FOR PLASMA TREATMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a matching circuit, and a method and an apparatus of a plasma treatment with a wide matching range. SOLUTION: The inside of a vacuum container 1 is held under prescribed pressure, while a given gas is fed from a gas supply apparatus 2 into the vacuum container 1 and evacuated by a turbo-molecular pump 3 as an evacuation unit. The plasma is generated in the container 1 by supplying high-frequency power of frequency f=100 MHz from a high-frequency power source 4 to an antenna 5 projected in the vacuum chamber. A method of the plasma treatment in a wide adjustment range is realized by using a copper plate as inductance in a matching circuit when a plasma treatment is carried out to a substrate 7 mounted on a substrate electrode 6. |
申请公布号 |
JP2002217669(A) |
申请公布日期 |
2002.08.02 |
申请号 |
JP20010008471 |
申请日期 |
2001.01.17 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
OKUMURA TOMOHIRO |
分类号 |
H05H1/46;H01L21/302;H01L21/3065;H01L21/31;H03H7/38 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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