| 摘要 |
PROBLEM TO BE SOLVED: To achieve a low-cost, accurate, reliable, an noise-resistant semiconductor physical quantity sensor. SOLUTION: Pads (3), (4) and (5) that are pulled down to the ground at the inside 21 of a semiconductor chip are arranged near a pad (1) for grounding, and at the same time, pads (6) and (7) that are pulled up to a power supply at the inside 21 of the semiconductor chip are arranged near a pad (2) for power supplies. In digital I/O pads, that have been trimmed digitally so that specific output can be obtained, the pull-down pads (3), (4), and (5), and the pad (1) for the ground are electrically connected to a ground terminal outside the chip via an internal exposure section 24, a wire 26, and an external wiring 29 for ground connection, and at the same time, the pulled-up pads (6) and (7), and the pad (2) for the power supply are electrically connected to a power supply terminal outside the chip via an internal exposure section 24, the wire 26, and the external wiring 29 for ground connection. Each terminal is connected mutually and electrically on a package or a packaging board. |
