| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for containing semiconductor element in which each electrode of a semiconductor element can be electrically connected with a wiring conductor surely and the semiconductor element can be operated normally. SOLUTION: The package for containing semiconductor element comprises a wiring substrate 1 having a plurality of insulation layers of organic material provided with a central through hole 1a for containing a semiconductor element S, a wiring conductor 8 formed on the surface of the insulation layer while being led out partially to the wall face of the through hole 1a and a through hole conductor 13 formed substantially entirely on the wall face of the through hole 1a and connecting the wiring conductors 8 led out to the wall face electrically, and a metallic heat dissipation plate 3 bonded to the lower surface of the wiring substrate 1 through an insulating bond layer 2 to close the through hole 1a. A part 7b for extending the through hole conductor 13 around the through hole 1a within a range of 0.2-5 mm is formed on the lower surface of the wiring substrate 1, and an earth or power supply wiring conductor 7a of wide area is disposed on the outside region of the extended part 7b. |
