TAPE CARRIER AND SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To obtain a tape carrier for COF which causes large friction when the carrier is pressurized and can obtain strong bonding strength when the carrier is bonded by thermocompression. SOLUTION: This TAB tape carrier is constituted by forming a wiring pattern containing leads 4 for COF connection on one surface of a tape substrate 22 composed of an insulating resin film by sticking copper foil 2 to the surface and photoetching the foil 2, and then, protecting the surface of the pattern with a solder resist film 16. Copper foil having such surface roughness that can make the maximum surface roughness of the leads 4 for COF connection contained in the wiring pattern to fall within the range of 2.0-8μm is used as the copper foil 2 so that the tape carrier may obtain the high bonding strength when the carrier is bonded by thermocompression.