LAMINATED POWER AMPLIFIER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a miniaturized power amplification module for radio or portable communication equipment. SOLUTION: Laminated substrates using passive integration components formed in silicon or stainless steel substrates interconnect with active elements mounted on the surface of the substrate to form the miniaturized power amplification module. Metal filled vias pass through a plurality of layers and carry electrical signals to and from the active elements and passive components. The metal filled vias function as thermal transfer heat sinks to transfer heat away from the active elements and the module.