SYSTEM AND METHOD FOR EXPOSING PERIPHERY OF WAFER

摘要

PROBLEM TO BE SOLVED: To obtain a system for exposing the peripheral part of resist applied to a semiconductor wafer accurately in which the peripheral part of a resist film is exposed appropriately at all times regardless of variation in the height of an exposing surface. SOLUTION: The system comprises an optical section 36 for irradiating the peripheral part of a semiconductor wafer 34 with exposing light wherein the optical section 36 comprises a focus sensor 37 for detecting the distance between the lower end of the optical section 36 and the peripheral part of the semiconductor wafer 34. The inventive system further comprises a position adjusting mechanism 38 for moving the optical section 36 up and down based on a detection value of the focus sensor 37 such that the detected distance matches the focal length of the optical section 36.