| 摘要 |
PROBLEM TO BE SOLVED: To enable a mechanical joint between a connecting electrode of an electronic part and a conductor pattern of a mounting board to be improved in strength and stability through a simple process without having an adverse effect on the operation of the electronic part. SOLUTION: In a method for manufacturing the electronic device, the electronic part 13 and the mounting board 11 are arranged so as to make one side 13a of the electronic part 13 confront one side 11a of the mounting board 11, and the connecting electrode 14 of the electronic part 13 is electrically connected and mechanically joined to the conductor pattern 12 of the mounting board 11. Then, a resin film 15 is disposed on the electronic part 13 and the mounting board 11, and the resin film 15 is changed in shape so as to come into close contact with the electronic part 13 and the mounting board 11. Then, the resin film 5 is bonded to the mounting board 11 by heating while the resin film 15 is pressed against the mounting board 11 around the electronic part 13 by a jig 30.
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