| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor device of small size, thin shape, and high integration density. SOLUTION: An insulating sheet 4 on which circuit patterns are formed is arranged on an IC chip 1 mounted on a substrate 2, and electronic components 6, 7, 8 are electrically connected to the circuit patterns on the insulating sheet 4, to realize the semiconductor device. |
