| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode which can efficiently extract the light emitted from a LED chip from a light-emitting surface, and also to provide a backlight device using the same. SOLUTION: The LED chip 4 is electrically connected by flip-chip bonding to a pair of external electrodes 3 on a substrate 2 via bumps 5. On the substrate 2, whereon the LED chip 4 is flip-chip bonded, a lamp house 6, having a through- hole 6a surrounding the LED chip 4 is provided. The through-hole 6a is filled with a molding resin 8. By controlling the height and tilt angle of the through- hole 6a of the lamp house 6, the directional characteristics of the light emitting diode 1 can be controlled. |
