| 摘要 |
PROBLEM TO BE SOLVED: To obtain superior electrical continuity of a small diameter inner via hole for realizing a high density wiring pattern, regarding a printed wiring board having the inner via hole. SOLUTION: In a method for manufacturing this printed wiring board, an insulating resin layer is arranged on one side surface of an organic nonwoven fabric member which is impregnated with resin, so that unevenness of a surface which is caused by nonwoven fabric fiber can be eliminated. As a result, a penetration hole, formed by a laser working method, can be formed stably in a desired size.
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