| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wring board, which can ensure strength by ensuring total thickness and control required characteristics impedance at a low cost, and to provide a manufacturing method of a multiplayer printed wiring board. SOLUTION: A multilayer printed wiring board 1, having a multilayer structure, has a core base material 10 wherein a power supply layer 12 is formed in one surface, and a ground layer 14 is formed in the other surface, a dielectric layer 30, which is formed in either the power supply layer 12 or the ground layer 14 of the core base material 10 and has relative dielectric constant of 3 or larger, a conductive layer 40 formed on the dielectric layer 30, a first prepreg layer 50 formed on the conductive layer 40, a second prepreg layer 60 formed in either the ground layer 14 or the power supply layer 12, a first conductor layer 70 formed on the first prepreg layer 50 and a second conductor layer 80 formed on the second prepreg layer 60.</p> |
