HARDENING FLUX, SOLDERED JOINT, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a hardening flux which can dispense with a cleaning operation of removing a residual flux after a soldering operation is carried out, is kept high in electrical insulation properties even in an atmosphere of high temperature and high humidity, and capable of realizing a soldered joint which is high in bond strength and reliability. SOLUTION: Resin (A) having at least one or more phenolic hydroxyl groups, resin (B) acting as an oxidizing agent against the resin (A), and a solvent (C) whose boiling point is 100 deg.C or above are compounded as integral components.