| 摘要 |
PROBLEM TO BE SOLVED: To make possible the mounting and wiring of a narrow-pitch multi-pin flip chip using a multilayered substrate and having a zigzag pad arrangement. SOLUTION: The heights of connecting members between inner and outer pads of the narrow-pitch multi-pin flip chip having the zigzag pad arrangement and inner and outer pads of a sub-substrate are changed from each other. The mounting and wiring of the flip chip and the connection of a fine-pitch semiconductor chip are made possible by connecting the inner and outer pads of the flip chip to the pads of different layers of the sub-substrate, and making the wiring from each layer of the sub-substrate. |
