| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of surely and electrically connecting a semiconductor chip to the terminals of a board. SOLUTION: A semiconductor device is equipped with bumps 8 formed on the electrode pads 9 of a semiconductor chip 5 and board terminals 3 formed on a board 1, and the bumps 8 and the board terminals 3 are electrically connected together through conductive paste 7 filling through-holes provided in dams 2. |
