| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting apparatus and a manufacturing method for cutting an element without damaging the element, in which a piezoelectric part with a protective film formed on the surface of the element and on the surface of the electrode is cut. SOLUTION: A piezoelectric board 4 having a protective film, which is formed after an electrode is formed, is cut with a cutting blade 6, while an alkaline solution with an added soluble material is fed to the cutting part to cool and neutralize the charges.
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