| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminate which can be applied to the manufacture of the laminate containing various substrates and members, by solving the problem that e.g. a substrate on which the laminate is arranged or a member which is contained in the laminate is limited, because a process to be performed under severe conditions such as a high-temperature treatment or the like is contained in a conventional method for manufacturing the laminate such as a semiconductor device or the like used to sequentially form a layer or a region on a substrate. SOLUTION: A first isolation layer, an intermediate layer and a body to be transferred are formed sequentially on a first substrate. The body to be transferred and a second isolation layer which is formed on a second substrate are bonded via a first bonding layer. The first isolation layer is irradiated with light, an exfoliation in the first isolation layer is induced, and the first substrate is detached. A third substrate and the intermediate layer are bonded via a second bonding layer. A heating operation is performed, an exfoliation in the second isolation layer is induced, and the second substrate is detached.
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