| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device and a method capable of restraining foreign objects from being left on a bonding stage on which a connection object is placed through a conductive particle-containing film, heated and compressed, and stably carrying out a bonding operation. SOLUTION: This bonding device has a structure composed of the bonding stage 10 on which an LCD panel 1 and a film board 6 are installed so as to make their prescribed electrodes 1a and 6a confront each other through a conductive particle-containing film 4, a bonding head 11 heating and compressing bonding target objects placed on the bonding stage 10, and a protective sheet feed unit 13 which previously feeds a detachable protective sheet 12 covering the bonding stage 10 before the bonding target objects are installed. The bonding stage 10 can be protected from foreign objects originated from the bonding target objects and the conductive particle-containing film 4 by the protective sheet 12, and a stable bonding operation can be carried out in a foreign object- free state by replacing the protective sheet 12 with a new one.
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