| 摘要 |
PROBLEM TO BE SOLVED: To provide an on-vehicle electronic device excellent in heat dissipation characteristic, waterproof characteristic, and anti-vibration characteristic, using small and a high-density electronic substrate. SOLUTION: A structure is constituted that a connection pin 22a inserted by pressing in a connector part of a connector housing 20 is soldered to an open sided free end 40a that is an one end of the electronic substrate 40, and an exothermic parts 41 are fixed in the other end. Under a face of an annular frame component 23, which is a part of connector housing 20, and is integrated in one, a base 10 by aluminum die-casting is fixed by adhesion fixation, and a generated heat of the exothermic parts 41 is heat-conducted to a heat conducting face 12. A cover 30 is fixed by adhesion fixation to the upper surface of the annular frame component 23. By bending distortion of the open-sided free end 40a of the electronic substrate 40, a height size error of right and left of the electronic substrate 40 and a stress of a soldering part by heat expansion of the connection pin 22a are absorbed.
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