| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that a large area substrate is considerably warped when the substrate is conveyed or held in a cassette in a manufacturing process of a semiconductor device, and this warpage particularly causes a decrease in processability of a vertical batch processing unit, that is, the width of the substrate housed in the cassette must be manufactured wider due to this warpage, so that the number of the substrate housed in the cassette is reduced. SOLUTION: A holding unit 203 for holding the substrate is provided near the center of the cassette 206 of the substrate, and the warpage of the substrate 201 is reduced. Robot arms 204 are formed in a fork shape so as not to be interfered with the cassette 206. More specifically, a holding part 209 for holding the substrate is provided near the center of the cassette 212 of the substrate, and the warpage of the substrate 207 is reduced. Robot arms 210 are formed in a fork shape so as not to be interfered with the cassette 212.</p> |
