发明名称 POLISHING APPARATUS, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To improve a uniform accuracy in polishing a substrate without accelerating deterioration of a polishing pad and increasing labor for maintenance. SOLUTION: Between a reference plate 51 fixed to a spindle 29 and a pad plate 52 sustained rocking freely by the spindle 29, a magnetic fluid inclusion 53 is arranged as a means to give a forced moment in the rocking direction to the pad plate 52. In an electromagnet sustaining member 70 which is a non- rotating member arranged above the reference plate 51, a plurality (the same number) of electromagnets 72, 72,... are arranged on the two axes in the radial direction orthogonally crossing through the center of the electromagnet sustaining member 70 in the attitude extending upward and downward, directly above the magnetic fluid inclusion 53. While a substrate W is polished, the electromagnets 72, 72,... are controlled by electric current so that the polishing surface of a polishing pad 54 is in parallel to the polished surface of the substrate W at all times.
申请公布号 JP2002217153(A) 申请公布日期 2002.08.02
申请号 JP20010007951 申请日期 2001.01.16
申请人 NIKON CORP 发明人 UDA YUTAKA
分类号 B24B37/005;H01L21/304 主分类号 B24B37/005
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