发明名称 MANUFACTURE OF THIN-FILM SEMICONDUCTOR ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin-film semiconductor element in which a solar battery element or the like may be embedded easily to a thin and soft holding material by utilizing an adhesive sheet, when a semiconductor element formed on a semiconductor substrate is removed. SOLUTION: After the adhesive sheet 17 has been bonded to the surface side of a photoelectric converting part 10A on the semiconductor substrate 11, this photoelectric converting part 10A is removed from the semiconductor substrate 11 at a porous silicon layer 12. After this removing process, a film 19 is bonded to the rear surface side of the photoelectric converting part 10A. Thereafter, the adhesive sheet 17 is removed, through the heating process, from the photoelectric converting part 10A to expose the surface electrodes 15, 16. Here, the lead electrodes 20, 21 are connected to the exposed surface electrodes 15, 16 using a soldering process, and thereafter the film 22 is bonded to the front surface side of the photoelectric converting part 10A. Thereby, a solar battery element 10, which is embedded in a soft and thin film, can be manufactured.</p>
申请公布号 JP2002217437(A) 申请公布日期 2002.08.02
申请号 JP20010013976 申请日期 2001.01.23
申请人 SONY CORP 发明人 MATSUSHITA TAKESHI;MIZUNO SHINICHI
分类号 H01L31/04;H01L21/02;(IPC1-7):H01L31/04 主分类号 H01L31/04
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