发明名称 MULTILAYER PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multiplayer printer-wiring board in which standing waves and reflection are not generated. SOLUTION: A field via 360 which passes interlayer insulating layers 144, 244 is arranged just above a coaxial through hole 66. An interconnection is not drawn in a direction parallel to the printed-wiring board. As a result, the standing waves and the reflection are not produced in the through hole 66 and the field via 360, and the electrical characteristic of the multiplayer printer- wiring board can be increased.
申请公布号 JP2002217542(A) 申请公布日期 2002.08.02
申请号 JP20010013349 申请日期 2001.01.22
申请人 IBIDEN CO LTD 发明人 SEGAWA HIROSHI
分类号 H05K3/28;H05K3/00;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/28
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