| 摘要 |
PROBLEM TO BE SOLVED: To enable a solder to be supplied efficiently in a prescribed pattern to a recess of a mounting substrate, such as MID substrate or the like. SOLUTION: An apparatus for supplying the solder comprises a base member 1, and a movable member 2 for solder transfer capable of displacing with respect to the surface of the member 1. In this case, the member 2 is constituted so as to be able to be switched between a state, in which the surface is flush with the surface of the member 1 and a state, in which the member 2 is projected from the surface of the member 1. A method for supplying the solder comprises the steps of printing the solder B in the prescribed pattern on the surface of the member 2, in a state in which the surface of the member 1 is flush with the surface of the member 2, thereafter contacting the surface of the member 2 projected from the member 1 with the recess Wa of the substrate W, and transferring to supply the solder B printed on the surface of the movable member to the recess Wa of the substrate W.
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