发明名称 Etching locally-constricted groove in e.g. micro-fluidic component surface uses combined mask assembly to etch constriction, passivation layer and wider groove sections
摘要 <p>A first etching mask is produced on the component (11). This has an etching window producing a narrow groove (15). The first mask is covered by a passivation layer. On the passivation layer a second etching mask including two long openings of greater width than the etching window located between them, is produced for a first etching process. This produces connecting groove sections (12, 13) on each side of the groove in a first etching process. The passivation layer is then removed. In the subsequent etching process, the component is etched in the region of the etching openings and the etching window. An independent claim is included for plates for liquid, produced by the method.</p>
申请公布号 DE10104323(A1) 申请公布日期 2002.08.01
申请号 DE2001104323 申请日期 2001.01.24
申请人 SIEMENS AG 发明人 KRETSCHMER, HANS-RICHARD;PETSCH, KATHRIN;STECKENBORN, ARNO
分类号 B81B1/00;B81C1/00;(IPC1-7):B81C1/00;H01L21/308;B81B7/00 主分类号 B81B1/00
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