| 摘要 |
An integrated circuit package is mounted on a socket pedestal. External terminals such as ball electrodes may be provided in an array on a mounting surface. Recessed sections can also be provided in the mounting surface in a peripheral section of a region where the external terminals are arranged. The recessed sections can be used for positioning. When the integrated circuit package is subject to an electrical characteristic test (or a burn-in test), the recessed sections can be coupled to protrusions provided on a side of a socket and positioned. As a result, the external terminals can be securely and accurately connected to socket terminals. Thus, integrated circuit packages are provided which have arrayed electrodes for face-down mounting, and which improves the connection accuracy with respect to a socket for conducting electrical characteristic tests.
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