SUPPORT SUBSTRATE FOR INTEGRATED CIRCUIT CHIP ADAPTED TO BE PLACED IN A MOULD

摘要

The invention concerns a substrate, in particular a multilayer substrate constituting a mounting and electrical connection support, having a mounting surface (2) for at least an integrated circuit chip (3) and capable of being placed, equipped with said chip, in an injection mould (8) having two parts enclosing between them the periphery of the substrate and one of which defines a cavity for moulding (15) a coating material to encapsulate said chip and has a support surface on said mounting surface wherein is provided at least a recess (16) defining, above said mounting surface, a slot (17) constituting a gas vent. Said mounting surface (2) has a zone whereon is provided an outer metal layer (6) arranged so as to extend along said recess (16) and on said support surface (12) on either side of said recess.