| 摘要 |
A single-chip IC device has an on-board CPU, an I/O bus controller, and a memory controller all implemented in semiconductor devices on the chip. The CPU, I/O bus controller, and memory controller are interconnected on the IC chip by a parallel data and address bus formed by the IC manufacturing techniques of deposition, patterning, and etching. In a preferred embodiment the on-board local bus has 32 address and 32 data lines. Also in a preferred embodiment the I/O bus controller has 32 data and address paths off the die for connection to a multiplexed I/O bus. The memory controller in the same embodiment has 32 data and 11 address paths off the die to a memory bus with 43 data and address lines. The I/O bus controller is configured to rout memory requests from peripheral devices through the memory controller directly to system memory.
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