| 摘要 |
A thermal exchanger assembly for a wafer chuck and method of use therefor is disclosed. More particularly, complimentary manifolds, each having a plurality of fins, are positioned with respect to one another to provide interleaved spaced-apart fins. At least one thermo-electric device is disposed between alternating pairs of fins. The thermo-electric device is coupled to the fins to provide a thermally conductive path from one manifold to the other through the thermo-electric device. The thermal exchanger assembly may be located in a process chamber for processing a wafer, including but not limited to a semiconductor wafer.
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