SYSTEMS AND METHODS FOR APPLICATION OF ATMOSPHERIC PLASMA SURFACE TREATMENT TO VARIOUS ELECTRONIC COMPONENT PACKAGING AND ASSEMBLY METHODS

摘要

This invention is related to a method for effecting metallic bond region modification in electronic components comprising metallic bond regions, the method comprising the steps of: transporting an electronic component having at least one metallic bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5 x 10<5> Pa to about 3.0 x 10<5> Pa, thereby forming a treated electronic component.